tsmc weathers currency storm, cnbc reports
Hsinchu City, Tuesday, 29 July 2025.
Despite facing currency headwinds, Taiwan Semiconductor Manufacturing Company (TSMC) demonstrates resilience. The CNBC report highlights TSMC’s crucial role as a leading-edge foundry. Investors closely monitor the company’s financial performance and market position. TSMC’s stock, listed on both the NYSE (TSM) and the Taiwan Stock Exchange (2330.TW), remains a key indicator of the semiconductor industry’s health. The company’s ability to navigate currency challenges underscores its strength in the global market.
current stock performance
As of 12:42 PM CTT, Taiwan Semiconductor Manufacturing Co Ltd (2330-TW) saw its stock price at 1,130.00, a decrease of 15.00 points or 1.31% [1]. The stock’s opening price was 1,145.00, with the day’s high also at 1,145.00 and the low at 1,125.00 [1]. The previous day’s closing price was 1,145.00 [1]. The stock has fluctuated between a 52-week high of 1,160.00 (recorded on July 28, 2025) and a 52-week low of 780.00 (recorded on April 09, 2025) [1]. These metrics provide a snapshot of TSMC’s recent market activity and overall trading range.
key financial metrics
TSMC’s market capitalization stands at 1,020,774.6 million, with 25,932.73 million shares outstanding [1]. The company offers a dividend of 18.00, resulting in a dividend yield of 1.59% [1]. The beta is 1.57 [1]. The earnings per share (EPS) over the trailing twelve months (TTM) is 56.30, leading to a price-to-earnings ratio (P/E TTM) of 20.07 [1]. These figures are vital for investors assessing the company’s valuation and profitability. The absence of data for forward P/E, EBITDA, ROE, revenue, and margins suggests potential areas for further investigation [1].
manufacturing advancements and strategic shifts
TSMC continues to innovate in process technology, including Bipolar-CMOS-DMOS (BCD) power management [4]. Their BCD power management process features higher integration, a smaller footprint, and lower power consumption, covering nodes from 0.6 μm to 22 nm [4]. TSMC introduced a series of BCD process technology solutions in 2024 to meet the demands of HPC, AI, and high-efficiency mobile devices [4]. However, TSMC is set to formally exit the gallium nitride (GaN) foundry market on July 31, 2027, as Navitas Semiconductor partners with 力積電 for GaN chip production [8].
technology platform advancements
TSMC’s 7nm (N7) platform delivers significant improvements over the 16nm technology (N16), achieving up to 30% speed enhancement, 55% power saving, and a threefold increase in logic density [5]. This platform is widely used in smartphones, HPC, automotive, and digital consumer electronics [5]. The 6nm (N6) technology enhances process simplicity and productivity using extreme ultra-violet (EUV) lithography, offering improvements in power, performance and density over N7 [5]. Designers can adopt N6 while leveraging their N7 investments, as N6 has been in volume production since 2020 [5].
market dynamics and competitive landscape
The semiconductor industry is subject to various factors. Currency headwinds can impact revenue and profitability, requiring companies like TSMC to manage exchange rate risks effectively [1]. Strategic shifts, such as exiting the GaN market, also reflect changing market dynamics and the company’s focus on core competencies [8]. Competition from other players and geopolitical factors add complexity [alert! ‘the source does not provide explicit expert views, but the stock analysis site implies caution due to these factors’]. These elements collectively shape investor sentiment and TSMC’s stock performance.