ASML set to unveil cutting-edge EUV technology at SEMICON Japan 2024
Tokyo, Friday, 6 December 2024.
ASML Holding N.V. is preparing to present its latest advancements in extreme ultraviolet lithography systems at SEMICON Japan 2024. These innovations promise to significantly boost efficiency in chip manufacturing, reinforcing ASML’s dominant position in the semiconductor lithography market. The event, scheduled for December 11-13, 2024, in Tokyo, Japan, is expected to attract top industry professionals. ASML’s new developments aim to address the growing demand for more powerful and efficient semiconductor technologies. By enhancing resolution and throughput, these systems could redefine industry standards. This presentation comes at a pivotal time as the semiconductor industry faces rapid technological shifts and geopolitical challenges. Attendees will gain insights into how ASML plans to navigate these complexities while maintaining its competitive edge. The unveiling of these EUV advancements underscores ASML’s commitment to driving innovation in semiconductor manufacturing.
Market leadership and technological progress
ASML continues to dominate the extreme ultraviolet (EUV) lithography market with approximately 90% market share [5]. The company’s latest systems target impressive performance metrics, aiming to achieve throughput of up to 280 wafers per hour [3]. These advancements support the industry’s push toward smaller chip features, with technology roadmaps indicating capability to produce chips with features as small as 0.5 nanometers by the early 2030s [3].
Financial outlook and industry dynamics
Despite market uncertainties, ASML’s financial trajectory remains robust, with analysts projecting sales to reach €36.7 billion by 2025 [5]. The company’s order book demonstrates strong demand, with a significant backlog of 27 EUV systems valued at approximately 2.8 billion euros as of Q2 2024 [3]. This growth comes amid increasing demand for AI-related chips, though economic challenges in Europe and geopolitical tensions could impact future performance [5].
Strategic industry partnerships
ASML’s industry influence is evident in recent developments, including former CEO Eric Meurice’s appointment to Intel’s board of directors on December 4, 2024 [2]. This appointment highlights the deep interconnections within the semiconductor industry and ASML’s strategic positioning. During his tenure as CEO from 2004 to 2013, Meurice led ASML to a five-fold increase in market value [2].
Technology roadmap and future developments
The company’s latest EUV systems demonstrate significant improvements in resolution and efficiency [1]. The new EXE platform achieves a critical dimension of 8 nm using high NA EUV technology [3]. These developments align with major manufacturers’ needs, as demonstrated by TSMC’s implementation of EUV lithography in their seven-nanometer plus process, which is already in high-volume production [3].