china advances in euv tech amid us challenges

china advances in euv tech amid us challenges

2025-01-20 asml

Shanghai, Monday, 20 January 2025.
Chinese researchers have achieved a major breakthrough in extreme ultraviolet (EUV) lithography technology, challenging the dominance of the Dutch company ASML. This development comes at a critical time as the U.S. intensifies technology restrictions. A team from the Harbin Institute of Technology has created a compact, cost-efficient EUV light source with a wavelength of 13.5 nanometers. This innovation could shift the balance in the global semiconductor industry. The project recently won first prize at a regional innovation competition, signaling its significant potential impact. The technological approach taken by the Chinese team differs markedly from traditional Western methods, highlighting an inventive strategy to overcome current challenges. This leap forward could reduce China’s reliance on foreign technology, positioning the country as a formidable competitor in the semiconductor sector. The advance addresses the pressing need for reliable EUV light sources in the rapidly evolving photolithography market.

Novel approach to EUV technology

The research team at Harbin Institute of Technology has developed an innovative ‘discharge plasma extreme ultraviolet lithography light source’ that fundamentally differs from Western methods [1]. Led by Professor Zhao Yongpeng, the project boasts high energy conversion efficiency and employs particle acceleration radiation to generate EUV light [1][2]. This approach contrasts with ASML’s technology, which relies on American light sources and German Leica lens technology [2].

Technical hurdles remain

Despite this breakthrough in light source technology, significant challenges persist in developing a complete EUV lithography system [2]. A fully functional EUV exposure machine requires mastery of four critical components: the advanced EUV light source, lens systems, dual-wafer platform, and control systems [2]. These elements form what industry experts call the ‘moat’ around high-end EUV exposure machine production [2].

ASML’s market position

ASML currently maintains its position as the industry giant in EUV technology [2]. Their most advanced EUV equipment, priced between $170 million and $370 million per unit, serves leading semiconductor manufacturers including TSMC, Intel, and Samsung [3]. The company supports its global operations with thousands of engineers providing customer assistance [3].

Practical implementation challenges

The practical deployment of EUV technology faces unique operational challenges. ASML’s systems require extremely precise environmental conditions for optimal performance [3]. Even minor disturbances can affect operations - a fact demonstrated when an Intel facility discovered that methane from nearby cattle farms could impact machine performance through air filtration systems [3].

Bronnen


EUV Lithography Chinese Technology