samsung bets on glass to boost ai chip performance by 2028

samsung bets on glass to boost ai chip performance by 2028

2025-05-26 general

seoul, Monday, 26 May 2025.
samsung plans to use glass interposers instead of silicon in its next-generation ai chips by 2028. this strategic move aims to slash production costs. it will also improve the chips’ performance and lifespan. samsung is developing smaller glass units to speed up prototyping. this transition could reshape the competitive dynamics, challenging tsmc and nvidia in the advanced chip manufacturing arena. the company will use existing production lines in its Cheonan campus.

strategic shift in chip packaging

Samsung’s move to glass interposers is a significant shift from traditional silicon-based interposers [1][2][3]. Interposers are vital in 2.5D chip packaging, connecting gpus with high-bandwidth memory (hbm) in ai semiconductors [1]. The transition aims to improve precision for ultra-fine circuits and enhance dimensional stability [1]. This strategic change reflects a broader industry trend, with competitors like amd also exploring glass substrate technology [1]. Samsung’s approach involves developing sub-100x100 mm glass units to accelerate prototyping, differing from the larger 510x515 mm panels used by some competitors [1][2].

competitive advantages and market positioning

By adopting glass interposers, Samsung aims to gain a competitive edge in the rapidly expanding ai chip market [1][2][3]. The company’s strategy integrates foundry services, hbm memory, and advanced packaging into a unified ai solution [1]. Utilizing its Cheonan campus’s panel-level packaging (plp) line, which uses square panels instead of round wafers, further positions samsung favorably [1][2]. This transition could lead to increased revenue through external orders as the technology matures and demand grows [1]. The shift reflects samsung’s commitment to innovation and its proactive approach to meeting future customer demands [1].

investment analysis and stock implications

For investors, samsung’s transition to glass interposers presents both opportunities and considerations. The move could reduce manufacturing costs and improve chip performance, potentially boosting samsung’s market share and profitability [1][2]. However, the transition involves technological risks and requires significant investment in r&d and manufacturing infrastructure [alert! ‘quantify investment needed’]. Monitoring samsung’s progress in achieving its 2028 target and securing external orders will be crucial for assessing the long-term impact on its stock value. Investors should also watch how competitors like tsmc and nvidia respond to this shift [1].

Bronnen


ai chips glass interposers