EUV lithography at a crossroads: can hyper-na overcome scaling challenges?
Amsterdam, Tuesday, 12 August 2025.
A new study analyzes the future of EUV lithography. The current high-NA (0.55) systems may not be enough. Researchers are investigating reducing the wavelength or increasing the numerical aperture. ASML and its customers, like TSMC and Nvidia, depend on these advancements. These companies need to maintain their chip manufacturing capabilities and competitive edge. The study highlights technical challenges and opportunities. These will determine the path forward for semiconductor scaling.
The hyper-na advantage
Continued improvements in lithographic resolution are essential for further device scaling [1]. Historically, these improvements have been achieved by reducing the wavelength and increasing the numerical aperture (NA) [1]. Current efforts are focused on high-NA (0.55) EUV systems [1]. The next logical step involves either reducing the wavelength to less than 13.5 nm or increasing the NA beyond 0.55 [1]. This approach presents a pathway for further scaling, which is crucial for maintaining technological leadership in the semiconductor industry [1].
ASML’s market position
ASML’s stock (ASML:AMS) is significantly influenced by developments in EUV lithography [GPT]. As the primary EUV equipment supplier, ASML’s technological advancements directly impact its market position [GPT]. The feasibility and adoption of next-generation EUV technologies, such as Hyper-NA, will likely affect ASML’s order book and overall competitiveness [1]. Any delays or setbacks in these advancements could potentially create opportunities for competitors, though ASML currently holds a dominant position [alert! ‘need source for market share’] [GPT].
Alternative lithography solutions
While ASML focuses on EUV, alternative lithography methods are emerging [3][4]. Shanghai AMIES has delivered its 500th stepper lithography system, marking a breakthrough in China’s high-end semiconductor equipment industry [3]. AMIES’s products hold a 35% global market share and a 90% domestic market share [3]. Pulin Technology has also delivered a 10 nm nanoimprint lithography (NIL) system [4]. NIL offers a 90% reduction in energy consumption and significantly lower investment costs compared to EUV [4]. These developments could challenge ASML’s dominance in the long term [alert! ‘need expert opinion on the likelihood of disruption’].
High-NA EUV challenges and opportunities
The transition to Hyper-NA EUV lithography presents both opportunities and challenges for ASML [1]. While it allows for greater resolution and smaller feature sizes, it also requires significant investment in research and development [1]. The technical challenges associated with increasing the NA or reducing the wavelength are considerable [1]. ASML must navigate these challenges to maintain its technological edge and meet the demands of its customers, including TSMC and Nvidia [1]. Success in this area would likely strengthen ASML’s market position and positively influence its stock performance [alert! ‘stock market prediction is speculative’].